In‐vacuum cleaving and coating of semiconductor laser facets using thin silicon and a dielectric
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.363664
Reference11 articles.
1. Unified defect model and beyond
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3. In situ fabricated Ga2O3–GaAs structures with low interface recombination velocity
4. Molecular beam deposition of high quality silicon oxide dielectric films
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