Monoatomic layer removal mechanism in chemical mechanical polishing process: A molecular dynamics study
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.3327448
Reference31 articles.
1. Chemomechanical polishing of silicon: Surface termination and mechanism of removal
2. Tribology Analysis of Chemical‐Mechanical Polishing
3. Research on the molecular scale material removal mechanism in chemical mechanical polishing
4. Experimental investigation on mechanisms of silicon chemical mechanical polishing
5. Inhibitors for organic phosphonic acid system abrasive free polishing of Cu
Cited by 59 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Nanosecond laser irradiation assisted chemical mechanical polishing (CMP) process for promoting material removal of single crystal 4H–SiC;Ceramics International;2024-10
2. Friction Properties and Mechanism of Aluminum Sheets Under an Eco-Friendly CMCS Lubrication Condition;Tribology Letters;2024-01-27
3. Soft abrasive facilitating materials removal of SiO2/Si bilayer materials: A molecular dynamics study;Materials Chemistry and Physics;2023-01
4. Exploring the nano-polishing mechanisms of Invar;Tribology International;2022-11
5. Revealing the mechanisms for inactive rolling and wear behaviour on chemical mechanical planarization;Applied Surface Science;2022-09
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3