Soft abrasive facilitating materials removal of SiO2/Si bilayer materials: A molecular dynamics study

Author:

Chen JuanORCID,Fang Liang,Chen Huiqin,Sun Kun,Dang Shu'e,Han Jing

Funder

Shanxi Province Science Foundation for Youths

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science

Reference57 articles.

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3. The atomic scale removal mechanism during chemomechanical polishing of Silicon: an atomic force microscopy study;Katsuki,2005

4. Experimental investigation on mechanisms of silicon chemical mechanical polishing;Estragnat;J. Electron. Mater.,2004

5. Towards a deeper understanding of plastic deformation in mono-crystalline silicon;Zhang;Int. J. Mech. Sci.,2001

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