Heterodyn interferometer for the detection of electric and thermal signals in integrated circuits through the substrate
Author:
Publisher
AIP Publishing
Subject
Instrumentation
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1144348
Reference10 articles.
1. Electron beam testing
2. Noninvasive sheet charge density probe for integrated silicon devices
3. Picosecond noninvasive optical detection of internal electrical signals in flip-chip-mounted silicon integrated circuits
4. Picosecond backside optical detection of internal signals in flip-chip mounted silicon VLSI circuits
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