A MEMS thermal shear stress sensor produced by a combination of substrate-free structures with anodic bonding technology-Reference-Cited by-同舟云学术

A MEMS thermal shear stress sensor produced by a combination of substrate-free structures with anodic bonding technology

Published:2016-07-11 Issue:2 Volume:109 Page:023512
ISSN:0003-6951
Container-title:Applied Physics Letters
language:en
Short-container-title:Appl. Phys. Lett.

Author:

Ou Yi¹,Qu Furong¹,Wang Guanya¹,Nie Mengyan²,Li Zhigang¹,Ou Wen¹,Xie Changqing¹

Affiliation:

1. Key Laboratory of Microelectronic Devices and Integrated Technology, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, People's Republic of China

2. National Centre for Advanced Tribology at Southampton (n CATS), Engineering Sciences, University of Southampton, Southampton, SO17 1BJ, United Kingdom

Funder

Research and Developmeng of Major Research Equipment of CAS

National Natural Science Foundation of China (NSFC)

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Link

http://aip.scitation.org/doi/pdf/10.1063/1.4958842

Reference12 articles.

1. Shear stresses in magnetorheological fluids: Role of magnetic saturation

2. A microfabricated shear sensor array on a chip with pressure gradient calibration