Effect of current crowding on whisker growth at the anode in flip chip solder joints
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2822446
Reference13 articles.
1. Proceedings of the Surface Mount International Conference and Exhibition;Brandenburg S.,1998
2. Numerical simulation of current crowding phenomena and their effects on electromigration in very large scale integration interconnects
3. Current-crowding-induced electromigration failure in flip chip solder joints
4. Recent advances on electromigration in very-large-scale-integration of interconnects
5. Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints
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4. Modeling of growth rate and morphology mechanism of whisker and hillock on micro-bumps under temperature-pressure-humidity storage;Scripta Materialia;2022-03
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