Author:
Hauschildt M.,Gall M.,Justison P.,Hernandez R.,Ho P. S.
Subject
General Physics and Astronomy
Reference16 articles.
1. Reduced electromigration of Cu wires by surface coating
2. Reduced Cu interface diffusion by CoWP surface coating
3. E. Zschech, M. A. Meyer, and E. Langer, Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics, MRS Symposia Proceedings No. 812 (Materials Research Society, Pittsburgh, 2004), pp. 361–372.
4. Proceedings of the Materials for Advanced Metallization Conference;Meyer M. A.,2004
5. M Hauschildt, Ph.D. thesis, University of Texas-Austin, 2005.
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献