Potentiodynamic polarization effect on phase and microstructure of SAC305 solder in hydrochloric acid solution
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Reference26 articles.
1. Corrosion characterization of tin–lead and lead free solders in 3.5wt.% NaCl solution
2. Effect of Ag3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition
3. Mechanical and corrosion resistances of a Sn–0.7wt.%Cu lead-free solder alloy
4. Impurity and alloying effects on interfacial reaction layers in Pb-free soldering
5. Mechanical properties of Sn–Ag lead-free solder alloys based on the dendritic array and Ag3Sn morphology
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Influence of intrinsic manufacturing defects on corrosion behavior of AISI 420 stainless steel fabricated by laser powder bed fusion;Electrochimica Acta;2023-11
2. Effect of bismuth addition on the corrosion dynamics of Sn–3Ag–0.5Cu solder alloy in Hydrochloric Acid Solution;International Journal of Innovative Engineering Applications;2021-04-29
3. Corrosion behavior assessment of tin-lead and lead free solders exposed to fire smoke generated by burning polyvinyl chloride;Materials Chemistry and Physics;2018-06
4. Corrosion behavior of Sn-3.0Ag-0.5Cu solder under different fire smoke atmospheres generated by burning polyvinyl chloride and polyethylene;Materials and Corrosion;2017-11-28
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