Effect of bismuth addition on the corrosion dynamics of Sn–3Ag–0.5Cu solder alloy in Hydrochloric Acid Solution
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International Journal of Innovative Engineering Applications
Reference23 articles.
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3. [3] Jaffery, H.A., Sabri, M.F.M., Said, S.M., Hasan, S.W., Sajid, I.H., Nordin, N.I.M., Hasnan, M.M.I.M., Shnawah, D.A., Morrty, C.V., Electrochemical corrosion behavior of Sn-0.7Cu solder alloy with the addition of bismuth and iron, Journal of Alloys and Compounds, 810, 151925, 2019.
4. [4] Sun, L., Zhang, L., Properties and microstructures of Sn-Ag-Cu-X lead-free solder joints in electronic packaging, Advances in Materials Science and Engineering,1-16, 2015.
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