Theoretical analysis of electromigration-induced failure of metallic thin films due to transgranular void propagation
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.369532
Reference39 articles.
1. Electromigration in metals
2. Electromigration and IC Interconnects
3. Morphology of electromigration-induced damage and failure in Al alloy thin film conductors
4. Microstructural Analysis of Electromigration-Induced Voids and Hillocks
5. Slit morphology of electromigration induced open circuit failures in fine line conductors
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