Curved crystal lattice in resolidified submicron Al lines
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.118403
Reference11 articles.
1. Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines
2. Grain size dependence of electromigration‐induced failures in narrow interconnects
3. Experimental study of electromigration in bicrystal aluminum lines
4. Correlation of texture with electromigration behavior in Al metallization
5. ELECTROMIGRATION IN SINGLE‐CRYSTAL ALUMINUM FILMS
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1. Single crystallization of Al interconnection wires;Semiconductor Science and Technology;2002-09-18
2. The microstructure of submicrometer wide planar-reactive ion etched versus trench-damascene AlCu lines;Journal of Applied Physics;2000-11
3. Linewidth and underlayer influence on texture in submicrometer-wide Al and AlCu lines;Applied Physics Letters;1998-01-19
4. 1/fnoise in mono- and polycrystalline aluminum;Physical Review B;1998-01-01
5. Electromigration and 1/ƒ Noise in Single-Crystalline, Bamboo and Polycrystalline Al Lines;MRS Proceedings;1997
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