Dielectric property and microstructure of a porous polymer material with ultralow dielectric constant
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.124535
Reference17 articles.
1. Thermal Stability of Fluorinated SiO2 Films: Effects of Hydration and Film-Substrate Interaction
2. Fluorinated Amorphous Carbon as a Low-Dielectric-Constant Interlayer Dielectric
3. Integration of Low-k Dielectric Materials Into Sub-0.25-μm Interconnects
4. Poly(Arylene Ethers) as Low Dielectric Constant Materials for ULSI Interconnect Applications
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