1. 3. Ting C.H. , Conference Program and Abstracts, Advanced Metalization for ULSI Applications Conference, 1994.
2. 1. The National Technology Roadmap for Semiconductors, SIA, San Jose 1994 pp. 94–109.
3. 5. Leu J. , SEMATECH, private communication.
4. Copper-Based Metallization in ULSI Structures: Part II: Is Cu Ahead of Its Time as an On-Chip Interconnect Material?
5. 4. McKerrow A. J. , Ho P.S. , Leu J. and Ho H-. M. , Proceedings, Low Dielectric Constant Materials and Interconnect Workshop, 1996.