Spalling of Cu3Sn intermetallics in high-lead 95Pb5Sn solder bumps on Cu under bump metallization during solid-state annealing
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1739530
Reference6 articles.
1. Controlled Collapse Reflow Chip Joining
2. Microstructures of phased-in Cr–Cu/Cu/Au bump-limiting metallization and its soldering behavior with high Pb content and eutectic PbSn solders
3. High-temperature lead-free SnSb solders: Wetting reactions on Cu foils and phased-in Cu–Cr thin films
4. Dewetting of molten Sn on Au/Cu/Cr thin‐film metallization
5. Interfacial reaction and wetting behavior in eutectic SnPb solder on Ni/Ti thin films and Ni foils
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