Directional reactive ion etching at oblique angles
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.91554
Reference4 articles.
1. Preferential SiO2Etching on Si Substrate by Plasma Reactive Sputter Etching
2. Profile control by reactive sputter etching
3. Surface relief structures with linewidths below 2000 Å
4. Ion‐surface interactions in plasma etching
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