Stress mapping of micromachined polycrystalline silicon devices via confocal Raman microscopy-Reference-Cited by-同舟云学术

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Stress mapping of micromachined polycrystalline silicon devices via confocal Raman microscopy

Published:2014-05-12 Issue:19 Volume:104 Page:191908
ISSN:0003-6951
Container-title:Applied Physics Letters
language:en
Short-container-title:Appl. Phys. Lett.

Author:

Myers Grant A.,Hazra Siddharth S.,de Boer Maarten P.,Michaels Chris A.,Stranick Stephan J.,Koseski Ryan P.,Cook Robert F.,DelRio Frank W.

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Link

http://aip.scitation.org/doi/pdf/10.1063/1.4878616

Reference40 articles.

1. Effect of specimen size on Young's modulus and fracture strength of polysilicon

2. The mechanical strength of polysilicon films: Part 1. The influence of fabrication governed surface conditions

3. The mechanical strength of polysilicon films: Part 2. Size effects associated with elliptical and circular perforations

4. Strength Distributions in Polycrystalline Silicon MEMS

5. A Sequential Tensile Method for Rapid Characterization of Extreme-value Behavior in Microfabricated Materials

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