Silicon wafer bonding studied by infrared absorption spectroscopy
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.112631
Reference12 articles.
1. A Model for the Silicon Wafer Bonding Process
2. Silicon‐On‐Insulator by Wafer Bonding: A Review
3. Relationship between interfacial native oxide thickness and bonding temperature in directly bonded silicon wafer pairs
4. Spontaneous bonding of hydrophobic silicon surfaces
5. Hydrophobic silicon wafer bonding
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