Author:
Ezaham N. A.,Razak N. R. A.,Salleh M. A. A. M.
Reference20 articles.
1. Influence of Bi on microstructures evolution and mechanical properties in Sn–Ag–Cu lead-free solder
2. The Effects of Zinc Addition on the Microstructure, Melting Point and Microhardness of Sn-0.7Cu Lead-Free Solder Fabricated via Powder Metallurgy Method
3. Growth of an intermetallic compound layer with Sn-3.5Ag-5Bi on Cu and Ni-P/Cu during aging treatment
4. The effect of iron and bismuth addition on the microstructural, mechanical, and thermal properties of Sn–1Ag–0.5Cu solder alloy
5. Liang, J., N. Dariavach, and D. Shangguan, Metallurgy, Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials Mechanics, 10, (2007)
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献