Author:
Loryuenyong V.,Cheung N. W.
Subject
Physics and Astronomy (miscellaneous)
Reference18 articles.
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2. Mechanically induced Si layer transfer in hydrogen-implanted Si wafers
3. Cold ion-cutting of hydrogen implanted Si
4. Atomic-Layer Cleaving and Non-contact Thinning and Thickening for Fabrication of Laminated Electronic and Photonic Materials
5. Kinking of a Crack Out of an Interface
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1 articles.
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