Ultrahigh vacuum packaging and surface cleaning for quantum devices-Reference-Cited by-同舟云学术

Ultrahigh vacuum packaging and surface cleaning for quantum devices

Published:2021-02-01 Issue:2 Volume:92 Page:025121
ISSN:0034-6748
Container-title:Review of Scientific Instruments
language:en
Short-container-title:Review of Scientific Instruments

Author:

Mergenthaler M.¹^ORCID,Paredes S.¹,Müller P.¹^ORCID,Müller C.¹^ORCID,Filipp S.¹,Sandberg M.²^ORCID,Hertzberg J. B.²,Adiga V. P.²,Brink M.²,Fuhrer A.¹^ORCID

Affiliation:

1. IBM Quantum, IBM Research Europe–Zurich, Säumerstrasse 4, 8803 Rüschlikon, Switzerland

2. IBM Quantum, IBM Thomas J. Watson Research Center, Yorktown Heights, New York 10598, USA

Funder

Intelligence Advanced Research Projects Activity

National Center of Competence in Research Quantum Science and Technology

Publisher

AIP Publishing

Subject

Instrumentation

Link

https://aip.scitation.org/doi/pdf/10.1063/5.0034574

Reference14 articles.

1. Materials in superconducting quantum bits

2. Towards understanding two-level-systems in amorphous solids: insights from quantum circuits

3. 1/fnoise: Implications for solid-state quantum information

4. Decoherence in a superconducting quantum bit circuit

5. Suppression of low-frequency charge noise in superconducting resonators by surface spin desorption

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