Indium-based Flip-chip Interconnection for Superconducting Quantum Computing Application
Author:
Affiliation:
1. Tsinghua University,School of Integrated Circuits,Beijing,China
2. Beijing Computational Science Research Center,Quantum Physics and Quantum Information Division,Beijing,China
3. Beijing Academy of Quantum Information Sciences,Beijing,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873338.pdf?arnumber=9873338
Reference35 articles.
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