Solid-state growth kinetics of Ni3Sn4 at the Sn–3.5Ag solder∕Ni interface
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2149487
Reference17 articles.
1. Interfacial reaction of Pb-Sn solder and Sn-Ag solder with electroless Ni deposit during reflow
2. Effect of 0.5 wt % Cu addition in Sn–3.5%Ag solder on the dissolution rate of Cu metallization
3. Growth behavior of Ni3Sn4 layer during reactive diffusion between Ni and Sn at solid-state temperatures
4. Growth kinetics of Ni3Sn4 and Ni3P layer between Sn–3.5Ag solder and electroless Ni–P substrate
5. Relative rates of nickel diffusion and copper diffusion through gold
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4. Thermomechanical reliability of a Cu/Sn-3.5Ag solder joint with a Ni insertion layer in flip chip bonding for 3D interconnection;Journal of Materials Science: Materials in Electronics;2021-04-19
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