Electrochemical capacitance‐voltage depth profiling of nanometer‐scale layers fabricated by Ga+focused ion beam implantation into silicon

Author:

Mogul H. C.,Steckl A. J.,Webster Gyles,Pawlik M.,Novak S.

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. GaN/InGaN double quantum well (DQW) gate structure for GaN-on-Si based normally-off AlGaN/GaN high electron mobility transistors (HEMTs);Materials Science in Semiconductor Processing;2021-11

2. Enhanced recrystallization and dopant activation of P+ion-implanted super-thin Ge layers by RF hydrogen plasma treatment;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2017-09

3. C–V profiling of ultra-shallow junctions using step-like background profiles;Solid-State Electronics;2010-09

4. Electrochemical capacitance-voltage characterization of plasma-doped ultra-shallow junctions;Frontiers of Electrical and Electronic Engineering in China;2008-01

5. Effects of focused gallium ion-beam implantation on properties of nanochannels on silicon-on-insulator substrates;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;2005

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