Wide-angle display-type retarding field analyzer with high energy and angular resolutions-Reference-Cited by-同舟云学术

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Wide-angle display-type retarding field analyzer with high energy and angular resolutions

Published:2017-12 Issue:12 Volume:88 Page:123106
ISSN:0034-6748
Container-title:Review of Scientific Instruments
language:en
Short-container-title:Review of Scientific Instruments

Author:

Muro Takayuki¹,Ohkochi Takuo¹,Kato Yukako¹,Izumi Yudai¹,Fukami Shun²,Fujiwara Hidenori³,Matsushita Tomohiro¹

Affiliation:

1. Japan Synchrotron Radiation Research Institute (JASRI), 1-1-1 Kouto, Sayo, Hyogo 679-5198, Japan

2. Graduate School of Materials Science, Nara Institute of Science and Technology (NAIST), 8916-5 Takayama, Ikoma, Nara 630-0192, Japan

3. Graduate School of Engineering Science, Osaka University, 1-3 Machikaneyama, Toyonaka, Osaka 560-8531, Japan

Funder

MEXT | Japan Society for the Promotion of Science

Publisher

AIP Publishing

Subject

Instrumentation

Link

http://aip.scitation.org/doi/pdf/10.1063/1.4990769

Reference21 articles.

1. Photoelectron diffraction: new dimensions in space, time, and spin

2. Full hemispherical photoelectron diffraction and Fermi surface mapping

3. The study of the local atomic structure by means of X-ray photoelectron diffraction

4. Adsorbate structure determination using photoelectron diffraction: Methods and applications

5. Photoelectron Holography

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1. Use of planar retarding field to improve energy resolution of projection-type electron spectroscopy collimator analyzer;Japanese Journal of Applied Physics;2024-04-01

2. Photoelectron Holographic Study for Atomic Site Occupancy for Si Dopants in Si-Doped κ-Ga₂O₃(001);Nano Letters;2024-03-07

3. Photoelectron holographic evidence for the incorporation site of Se and suppressed atomic displacement of the conducting layer of La(O,F)BiSSe;Japanese Journal of Applied Physics;2023-11-21

4. Atomic-Resolution Holography;The Materials Research Society Series;2023-10-26

5. 新規穴あき銅格子を用いたリターディングフィールドアナライザーの研究開発;Journal of The Japan Institute of Electronics Packaging;2023-09-01

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