Gridless ionized metal flux fraction measurement tool for use in ionized physical vapor deposition studies
Author:
Publisher
AIP Publishing
Subject
Instrumentation
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1149618
Reference10 articles.
1. Filling dual damascene interconnect structures with AlCu and Cu using ionized magnetron deposition
2. Simulations of trench-filling profiles under ionized magnetron sputter metal deposition
3. Directional deposition of Cu into semiconductor trench structures using ionized magnetron sputtering
4. Cu metallization using a permanent magnet electron cyclotron resonance microwave plasma/sputtering hybrid system
5. Liner conformality in ionized magnetron sputter metal deposition processes
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2. 2D analysis of sputtered species transport in high-power impulse magnetron sputtering (HiPIMS) discharge;Journal of Applied Physics;2024-05-02
3. Insights into the copper HiPIMS discharge: deposition rate and ionised flux fraction;Plasma Sources Science and Technology;2023-12-01
4. Measurement of deposition rate and ion energy distribution in a pulsed dc magnetron sputtering system using a retarding field analyzer with embedded quartz crystal microbalance;Review of Scientific Instruments;2016-04
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