Fabrication of ultrathin and highly uniform silicon on insulator by numerically controlled plasma chemical vaporization machining-Reference-Cited by-同舟云学术

Fabrication of ultrathin and highly uniform silicon on insulator by numerically controlled plasma chemical vaporization machining

Published:2007-08 Issue:8 Volume:78 Page:086102
ISSN:0034-6748
Container-title:Review of Scientific Instruments
language:en
Short-container-title:Review of Scientific Instruments

Author:

Sano Yasuhisa,Yamamura Kazuya,Mimura Hidekazu,Yamauchi Kazuto,Mori Yuzo

Publisher

AIP Publishing

Subject

Instrumentation

Link

http://aip.scitation.org/doi/pdf/10.1063/1.2766836

Reference6 articles.

1. Plasma CVM (chemical vaporization machining): an ultra precision machining technique using high-pressure reactive plasma

2. Development of plasma chemical vaporization machining

3. Rapid, noncontact optical figuring of aspheric surfaces with plasma-assisted chemical etching

4. P. B. Mumola, G. J. Gardopee, T. Ferg, A. M. Ledger, P. J. Clapis, and P. E. Miller, Proceedings of the International Symposium On Semiconductor Wafer Bonding Science, Technology, and Applications (The Electrochemical Society, New York, 1993), p. 410.

5. Thinning of silicon-on-insulator wafers by numerically controlled plasma chemical vaporization machining

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