Photocurrent method for characterizing the interface of hydrophobically bonded Si wafers
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1544063
Reference10 articles.
1. Direct wafer bonding of III-V compound semiconductors for free-material and free-orientation integration
2. High‐performance InGaAs photodetectors on Si and GaAs substrates
3. Thin-film wafer fusion for buried-heterostructure InP-based lasers fabricated on a GaAs substrate
4. Electrical properties of wafer-bonded GaAs/Si heterojunctions
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