Experimental study and computer simulation of collimated sputtering of titanium thin films over topographical features
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.354889
Reference15 articles.
1. Influence of Impurities and Microstructure on the Resistivity of LPCVD Titanium Nitride Films
2. Collimated magnetron sputter deposition
3. Structural transitions in ballistic aggregation simulation of thin‐film growth
4. Simulation by ballistic deposition of local density variation and step coverage for via metallization
5. Simulation of density variation and step coverage for a variety of via/contact geometries using SIMBAD
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