Enhancement of Ti+density in high-pressure magnetron sputtering plasmas
Author:
Publisher
IOP Publishing
Subject
Surfaces, Coatings and Films,Acoustics and Ultrasonics,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
http://stacks.iop.org/0022-3727/43/i=12/a=124012/pdf
Reference42 articles.
1. Multilevel Aluminum Dual-Damascene Interconnects for Process-Step Reduction in 0.18 µm ULSIs
2. Magnetron sputter deposition with high levels of metal ionization
3. Metal ion deposition from ionized mangetron sputtering discharge
4. Trench filling by ionized metal physical vapor deposition
5. Directional and preferential sputtering-based physical vapor deposition
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