Low-temperature atomic-layer-deposition lift-off method for microelectronic and nanoelectronic applications
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1612904
Reference21 articles.
1. High-κ gate dielectrics: Current status and materials properties considerations
2. ALD precursor chemistry : Evolution and future challenges
3. Atomic Layer Deposition of Hafnium and Zirconium Oxides Using Metal Amide Precursors
4. Optical coatings deposited by reactive ion plating
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