Single-mask, three-dimensional microfabrication of high-aspect-ratio structures in bulk silicon using reactive ion etching lag and sacrificial oxidation-Reference-Cited by-同舟云学术

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Single-mask, three-dimensional microfabrication of high-aspect-ratio structures in bulk silicon using reactive ion etching lag and sacrificial oxidation

Published:2004-12-20 Issue:25 Volume:85 Page:6281-6283
ISSN:0003-6951
Container-title:Applied Physics Letters
language:en
Short-container-title:Appl. Phys. Lett.

Author:

Rao M. P.,Aimi M. F.,MacDonald N. C.

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Link

http://aip.scitation.org/doi/pdf/10.1063/1.1834720

Reference7 articles.

1. 16-k infrared micromirror arrays with large-beam deflection and .10-mm pixel size

2. Proceedings of 2002 IEEE∕LEOS International Conference on Optical MEMS;Sawada R.,2002

3. Gray-scale masks for diffractive-optics fabrication: II Spatially filtered halftone screens

4. Investigation of gray-scale technology for large area 3D silicon MEMS structures

5. Microscopic uniformity in plasma etching

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2. Silicon Etching for Multiple-Height Microstructures;Micro/Nano Technologies;2018

3. Silicon Etching for Multiple-Height Microstructures;Micro/Nano Technologies;2018

4. Silicon Etching for Multiple-Height Microstructures;Micro/Nano Technologies;2018

5. Ultrahigh Resolution Titanium Deep Reactive Ion Etching;ACS Applied Materials & Interfaces;2017-06-01

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