Polyelectrolyte nanolayers as diffusion barriers for Cu metallization
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1618951
Reference13 articles.
1. Materials aspects of copper interconnection technology for semiconductor applications
2. Self-assembled near-zero-thickness molecular layers as diffusion barriers for Cu metallization
3. Self-assembled subnanolayers as interfacial adhesion enhancers and diffusion barriers for integrated circuits
4. Multilayer Nanoreactors for Metallic and Semiconducting Particles
5. Polyelectrolyte-Cu(II) interactions studied by cyclic voltammetry
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