Probing diffusion barrier integrity on porous silica low-k thin films using positron annihilation lifetime spectroscopy
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1360704
Reference18 articles.
1. Particle-Packing Phenomena and Their Application in Materials Processing
2. Integration of Low Dielectric Constant Materials in Advanced Aluminum and Copper Interconnects
3. The Effects of Cu Diffusion in Cu/TiN/SiO2/Si Capacitors
4. Characterization of Thin Dielectric Films as Copper Diffusion Barriers Using Triangular Voltage Sweep
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