Effect of Al-trace degradation on Joule heating during electromigration in flip-chip solder joints
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2644061
Reference10 articles.
1. Recent advances on electromigration in very-large-scale-integration of interconnects
2. Electromigration study in SnAg3.8Cu0.7 solder joints on Ti/Cr-Cu/Cu under-bump metallization
3. High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints
4. Local melting induced by electromigration in flip-chip solder joints
5. Effect of the combination of electromigration and thermomigration on phase migration and partial melting in flip chip composite SnPb solder joints
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2. Interfacial reactions and nucleation of WAl12 phase on electromigration in hydrogen exposed semiconductor interconnects;Applied Surface Science;2023-03
3. Size Effect on the Electromigration Characteristics of Flip Chip Pb-free Solder Bumps;Electronic Materials Letters;2022-07-04
4. Enhancement of electromigration lifetime of copper lines by eliminating nanoscale grains in highly <111>-oriented nanotwinned structures;Journal of Materials Research and Technology;2021-11
5. The amorphous interphase formed in an intermetallic-free Cu/Sn couple during early stage electromigration;Scripta Materialia;2018-10
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