Local melting induced by electromigration in flip-chip solder joints-Reference-Cited by-同舟云学术

Local melting induced by electromigration in flip-chip solder joints

Published:2006-05 Issue:5 Volume:35 Page:1005-1009
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Tsai C. M.,Lin Y. L.,Tsai J. Y.,Lai Yi-Shao,Kao C. R.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/BF02692560.pdf

Reference20 articles.

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3. J.D. Wu, P.J. Zheng, K. Lee, C.T. Chiu, and J.J. Lee,Proceedings of the 2002 Electronic Components and Technology Conference (Piscataway, NJ: IEEE, 2002), p. 452.

4. E.C.C. Yeh, W.J. Choi, K.N. Tu, P. Elenius, and H. Balkan,Appl. Phys. Lett. 80, 580 (2002).

5. C.Y. Liu, C. Chen, C.N. Liao, and K.N. Tu,Appl. Phys. Lett. 75, 58 (1999).

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