Intrinsic stress in ZrN thin films: Evaluation of grain boundary contribution from in situ wafer curvature and ex situ x-ray diffraction techniques
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4710530
Reference46 articles.
1. Stress and preferred orientation in nitride-based PVD coatings
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4. Stress analysis of polycrystalline thin films and surface regions by X-ray diffraction
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