Kinetics of silicon stacking fault growth/shrinkage in an oxidizing ambient containing a chlorine compound
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.331312
Reference31 articles.
1. Surface Damage and Copper Precipitation in Silicon
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4. Oxidation, defects and vacancy diffusion in silicon
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1. Computer Simulation for Morphology, Size, and Density of Oxide Precipitates in CZ Silicon;Journal of The Electrochemical Society;2003
2. Oxygen partial pressure dependence of suppressing oxidation-induced stacking fault generation in argon ambient annealing including oxygen and HCl;Applied Surface Science;2001-08
3. Impurity Gettering;Encyclopedia of Materials: Science and Technology;2001
4. Generation of Point and Extended Defects During Oxidation and Silicidation of Silicon;Encyclopedia of Materials: Science and Technology;2001
5. Nucleation, growth and retrogrowth of oxidation induced stacking faults in thin silicon-on-insulator;Journal of Electronic Materials;1999-01
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