Application of electrospray-scanning mobility particle sizer for the measurement of sub-10 nm chemical mechanical planarization slurry abrasive size distribution-Reference-Cited by-同舟云学术

Application of electrospray-scanning mobility particle sizer for the measurement of sub-10 nm chemical mechanical planarization slurry abrasive size distribution

Published:2020-07-01 Issue:7 Volume:91 Page:075117
ISSN:0034-6748
Container-title:Review of Scientific Instruments
language:en
Short-container-title:Review of Scientific Instruments

Author:

Kwak Donggeon¹^ORCID,Kim Juhwan¹^ORCID,Oh Seungjun¹^ORCID,Bae Chulwoo²^ORCID,Kim Taesung¹²^ORCID

Affiliation:

1. Department of Mechanical Engineering, Sungkyunkwan University, Suwon 16419, South Korea

2. SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, Suwon 16419, South Korea

Publisher

AIP Publishing

Subject

Instrumentation

Link

http://aip.scitation.org/doi/pdf/10.1063/5.0007167

Reference20 articles.

1. Microelectronic Applications of Chemical Mechanical Planarization

2. Chemical Mechanical Planarization of Microelectronic Materials

3. Slurry Additive Effects on the Suppression of Silicon Nitride Removal during CMP

4. Further Investigation of Slurry Additives for Selective Polishing of SiO2Films over Si3N4Using Ceria Dispersions

5. Control of Adhesion Force Between Ceria Particles and Polishing Pad in Shallow Trench Isolation Chemical Mechanical Planarization

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