Low leakage ZrO2 based capacitors for sub 20 nm dynamic random access memory technology nodes
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4941537
Reference23 articles.
1. Fully Integrated 56 nm DRAM Technology for 1 Gb DRAM
2. Ultra-thin ZrO2/SrO/ZrO2 insulating stacks for future dynamic random access memory capacitor applications
3. SrTiO3 thin film capacitors on silicon substrates with insignificant interfacial passive layers
4. Conduction barrier offset engineering for DRAM capacitor scaling
5. Internal photoemission at interfaces of high-κ insulators with semiconductors and metals
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