Relationship between copper concentration and stress during electromigration in an Al(0.25 at. % Cu) conductor line
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1539282
Reference27 articles.
1. Reduction of Electromigration in Aluminum Films by Copper Doping
2. Electromigration in Al(Cu) two‐level structures: Effect of Cu and kinetics of damage formation
3. Segregation of copper in dilute aluminum - copper alloys
4. Inhibition of Electromigration Damage in Thin Films
5. Electromigration of copper in Al(0.25 at. % Cu) conductor lines
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1. Characterization of electromigration-induced short-range stress development in Al(0.25 at. % Cu) conductor line;Journal of Applied Physics;2024-01-12
2. Numerical Modeling of Electromigration in Al(0.25 at. % Cu) Interconnects;The Minerals, Metals & Materials Series;2024
3. A Critical Review on the Electromigration Effect, the Electroplastic Effect, and Perspectives on the Effects of Electric Current Upon Alloy Phase Stability;JOM;2019-07-26
4. Current-Induced Transport: Electromigration;In-Situ Electron Microscopy;2012-04-24
5. In SituElastic Strain Measurements—Diffraction and Spectroscopy;MRS Bulletin;2010-05
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