Numerical Modeling of Electromigration in Al(0.25 at. % Cu) Interconnects
Author:
Publisher
Springer Nature Switzerland
Link
https://link.springer.com/content/pdf/10.1007/978-3-031-50349-8_102
Reference15 articles.
1. Blech IA (1976) Electromigration in thin aluminum films on titanium nitride. J Appl Phys 47(4):1203–1208. https://doi.org/10.1063/1.322842
2. Wang P-C, Cargill GS III, Noyan IC, Hu C-K (1998) Electromigration-induced stress in aluminum conductor lines measured by x-ray microdiffraction. Appl Phys Lett 72:1296–1298. https://doi.org/10.1063/1.120604
3. Ames I, d’Heurle FM, Horstmann RE (1970) Reduction of electromigration in aluminum films by copper doping. IBM J Res Dev 14:461–463. https://doi.org/10.1147/rd.144.0461
4. Blech IA (1977) Copper electromigration in aluminum. J Appl Phys 48:473–477. https://doi.org/10.1063/1.323689
5. Hu C-K, Ho PS, Small MB (1992) Electromigration in two-level interconnect structures with Al alloy lines and W studs. J Appl Phys 72:291–293. https://doi.org/10.1063/1.352335
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