Hole transport mechanism at high temperatures in p-GaN/AlGaN/GaN heterostructure

Author:

Sikder Bejoy1ORCID,Hossain Toiyob1ORCID,Xie Qingyun2ORCID,Niroula John2ORCID,Rajput Nitul S.3ORCID,Teo Koon Hoo4ORCID,Amano Hiroshi5ORCID,Palacios Tomás2ORCID,Chowdhury Nadim1ORCID

Affiliation:

1. Department of Electrical and Electronic Engineering, Bangladesh University of Engineering and Technology 1 , Dhaka 1205, Bangladesh

2. Microsystems Technology Laboratories, Massachusetts Institute of Technology 2 , Cambridge Massachusetts 02139, USA

3. Advanced Materials Research Center, Technology Innovation Institute 3 , P.O. Box 9639, Abu Dhabi, United Arab Emirates

4. Mitsubishi Electric Research Labs 4 , Cambridge, Massachusetts 02139, USA

5. Nagoya University 5 , Furo-cho, Chikusa-ku, Nagoya 464-8601, Japan

Abstract

This Letter reports an investigation of hole transport in p-GaN/AlGaN/GaN heterostructures through experimental and theoretical analyses under varied conditions. Highly non-linear current–voltage (I–V) characteristics, obtained via the linear transmission line method measurements, are utilized for this study. At low bias voltage, the transport can be ascribed to the Schottky nature of the contact, while at high bias, the conduction is observed to be governed by space-charge limited current (SCLC). The Schottky characteristics (Schottky barrier height and non-ideality factor) and the SCLC exponent were analyzed for devices with varying contact spacings and at different high temperatures. The SCLC exponent, m, is in the range of 2≤m≤4 depending on the applied voltage range, revealing the existence of the trap states in the channel region. The findings of this work indicate that the charge injection, field-induced ionization, and trap states in the p-GaN channel are critical factors in the current transport of p-GaN/AlGaN/GaN heterostructure.

Funder

Samsung Electonics Co. Ltd

Qualcomm

Air Force Office of Scientific Research

Bangladesh University of Engineering and Technology

Publisher

AIP Publishing

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