Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4864406
Reference8 articles.
1. Review of Packaging of Optoelectronic, Photonic, and MEMS Components
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3. Fabrication of indium bumps for hybrid infrared focal plane array applications
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5. Red-green-blue polymer light-emitting diode pixels printed by optimized laser-induced forward transfer
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4. Laser-Induced Forward Transfer (LIFT) Technique as an Alternative for Assembly and Packaging of Electronic Components;IEEE Journal of Selected Topics in Quantum Electronics;2021-11
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