Bonding techniques for hybrid active pixel sensors (HAPS)-Reference-Cited by-同舟云学术

Bonding techniques for hybrid active pixel sensors (HAPS)

Published:2007-05 Issue:2 Volume:574 Page:392-400
ISSN:0168-9002
Container-title:Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
language:en
Short-container-title:Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Author:

Bigas M.,Cabruja E.,Lozano M.

Publisher

Elsevier BV

Subject

Instrumentation,Nuclear and High Energy Physics

Reference38 articles.

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4. M. Campbell, G. Aglieri-Rinella, G. Arnau-Izquierdo, et al., A fine pitch bump bonding process compatible with the manufacture of the pixel-HPD's for the LHCb RICH detector, in: IEEE Nuclear Science Symposium Conference Record, October 2004, pp. 657.

5. F. Hugging, The atlas pixel detector, in: IEEE Nuclear Science Symposium Conference Record, October 2004, pp. 1077.

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