3D sensors for the HL-LHC-Reference-Cited by-同舟云学术

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3D sensors for the HL-LHC

Published:2017-01-10 Issue:01 Volume:12 Page:C01026-C01026
ISSN:1748-0221
Container-title:Journal of Instrumentation
language:
Short-container-title:J. Inst.

Author:

Furelos D. Vázquez,Carulla M.,Cavallaro E.,Förster F.,Grinstein S.,Lange J.,Paz I. López,Manna M.,Pellegrini G.,Quirion D.,Terzo S.

Publisher

IOP Publishing

Subject

Mathematical Physics,Instrumentation

Link

http://stacks.iop.org/1748-0221/12/i=01/a=C01026/pdf

Reference11 articles.

1. Prototype ATLAS IBL modules using the FE-I4A front-end readout chip

2. The FE-I4 pixel readout integrated circuit

3. 3D silicon pixel detectors for the ATLAS Forward Physics experiment

4. First double-sided 3-D detectors fabricated at CNM-IMB

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Test beam measurement of ATLAS ITk Short Strip module at warm and cold operational temperature;Journal of Instrumentation;2023-03-01

2. Progress in 3D Silicon Radiation Detectors;Frontiers in Physics;2022-06-03

3. Radiation hardness of small-pitch 3D pixel sensors up to a fluence of 3×1016 neq/cm2;Journal of Instrumentation;2018-09-14

4. Radiation Hardness of Small-Pitch 3D Pixel Sensors up to HL-LHC Fluences;Springer Proceedings in Physics;2018

5. The Phase-II ATLAS ITk pixel upgrade;Journal of Instrumentation;2017-07-12

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