Dynamic fatigue and failure behavior of silver-filled electronically conductive adhesive joints at ambient environmental conditions-Reference-Cited by-同舟云学术

Dynamic fatigue and failure behavior of silver-filled electronically conductive adhesive joints at ambient environmental conditions

Published:2004-01 Issue:7 Volume:18 Page:731-750
ISSN:0169-4243
Container-title:Journal of Adhesion Science and Technology
language:en
Short-container-title:Journal of Adhesion Science and Technology

Author:

Gomatam Rajesh R.,Sancaktar Erol

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Link

http://www.tandfonline.com/doi/pdf/10.1080/10256018808623883

Reference12 articles.

1. Sancaktar, E. 1990.Engineering Materials Handbook, Vol. 3, Adhesives and Sealants, Edited by: Brinson, H. F. 501Materials Park, OH: ASM International. Technical Chairman

2. Fatigue Behaviour of Adhesive Bonded Joints

3. Structural Adhesive Joints in Engineering

4. Adhesion and Adhesives

5. Assessing stress state and mean load effects on the fatigue response of adhesively bonded joints

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