The interrelationships between electronically conductive adhesive formulations, substrate and filler surface properties, and joint performance. Part II: the effects of bonding pressure-Reference-Cited by-同舟云学术

The interrelationships between electronically conductive adhesive formulations, substrate and filler surface properties, and joint performance. Part II: the effects of bonding pressure

Published:2004-01 Issue:11 Volume:18 Page:1245-1261
ISSN:0169-4243
Container-title:Journal of Adhesion Science and Technology
language:en
Short-container-title:Journal of Adhesion Science and Technology

Author:

Gomatam Rajesh R.,Sancaktar Erol

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Link

http://www.tandfonline.com/doi/pdf/10.1080/10256018808623883

Reference25 articles.

1. Kang, S. K. and Purushothaman, S. 1998.Proc. 48th IEEE Electronic Components and Technology Conference1031

2. Pressure-dependent conduction behavior of various particles for conductive adhesive applications

3. The effect of pressure on the initial establishment of conductive paths in electronically conductive adhesives

4. Mechanical properties of adhesive filled with metal powders

5. The mechanical properties of an epoxy resin with a second phase dispersion

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Comparative study of the ideal and actual adhesion interfaces of the die bonding structure using conductive adhesives;The Journal of Adhesion;2020-08-24

2. Electrically Conductive Epoxy Adhesives;Polymers;2011-02-10

3. Yield Behavior of Moderately Filled Epoxy/Ni Suspensions;Journal of Adhesion Science and Technology;2010-01

4. Electrical Properties of Copper-Filled Electrically Conductive Adhesives and Pressure-Dependent Conduction Behavior of Copper Particles;Journal of Adhesion Science and Technology;2008-01

5. Novel Techniques for Characterization of Fast-Cure Anisotropic Conductive and Non-conductive Adhesives;Journal of Adhesion Science and Technology;2008-01