The effect of pressure on the initial establishment of conductive paths in electronically conductive adhesives-Reference-Cited by-同舟云学术

The effect of pressure on the initial establishment of conductive paths in electronically conductive adhesives

Published:1996-01 Issue:11 Volume:10 Page:1221-1235
ISSN:0169-4243
Container-title:Journal of Adhesion Science and Technology
language:en
Short-container-title:Journal of Adhesion Science and Technology

Author:

Sancaktar Erol,Yong Wei

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Link

http://www.tandfonline.com/doi/pdf/10.1080/10256018808623883

Reference10 articles.

1. Sancaktar, E. and Wei, Y. 1995.1995 Proceedings, International Symposium on Microelectronics, 231–236. Reston, VA: International Society of Hybrid Microelectronics.

2. Pernice, R. F., Hannafin, J. J. and Estes, R. H. 1994.1994 Proceedings, International Symposium on Microelectronics, 561–569. Reston, VA: International Society of Hybrid Microelectronics.

3. Nguyen, G., Williams, J. and Gibson, F. 1992.1992 Proceedings, International Symposium on Microelectronics, 510–517. Reston, VA: International Society of Hybrid Microelectronics.

4. Honore, J., Rubin, H. and Zierold, M. 1992.Proceedings of the Technical Program, National Electronic Packaging and Production Conference, Vol. 3, 1372–1380. Des Plains, IL: Cahner Exposition Group.

5. Brendfelt, K., Dral, J. and Wells, B. 1989.Proceedings of the Technical Program, Nepcon West '89, Vol. 1, 496–506. Des Plains, IL: Cahner Exposition Group.

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