Microwave Performance of Flip Chip Interconnects With Anisotropic and Non-conductive Films-Reference-Cited by-同舟云学术

Microwave Performance of Flip Chip Interconnects With Anisotropic and Non-conductive Films

Author:

Kim Jong-Woong¹,Lee Young-Chul²,Ko Jae-Hoon³,Nah Wansoo⁴,Jeong Myung Yung⁵,Kwon Hyuk-Chon⁶,Jung Seung-Boo⁷

Affiliation:

1. a School of Advanced Materials Science & Engineering, Sungkyunkwan University

2. b School of Advanced Materials Science & Engineering, Sungkyunkwan University

3. c School of Electrical and Computer Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon 440-746, South Korea

4. d School of Electrical and Computer Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon 440-746, South Korea

5. e School of Nano Science & Technology, Pusan National University, 30 Jangjeon-dong, Geumjeong-gu, Busan 609-735, South Korea

6. f Advanced Material Development Center, Korea Institute of Industrial Technology, 7-47, Songdo-dong, Yeonsu-gu, Incheon 406-840, South Korea

7. g School of Advanced Materials Science & Engineering, Sungkyunkwan University;, Email: sbjung@skku.ac.kr

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Link

Reference10 articles.

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