Effect of bonding force on the reliability of the flip chip packages employing anisotropic conductive film with reflow process
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference17 articles.
1. Flip Chip Technologies;Lau,1995
2. Low Cost Flip Chip Technologies for DCA, WLCSP and PBGA Assemblies;Lau,2000
3. Solid state interfacial reaction and joint strength of Sn–37Pb solder with Ni–P under bump metallization in flip chip application
4. Effect of aging conditions on interfacial reaction and mechanical joint strength between Sn–3.0Ag–0.5Cu solder and Ni–P UBM
5. Damages and Microstructural Variation of High-lead and Eutectic SnPb Composite Flip Chip Solder Bumps Induced by Electromigration
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